Estimating chemical mechanical polishing pad wear with compressibility

International Journal of Advanced Manufacturing Technology

Volumn 32, Issue 7-8, 2007, Pages 682-689

  Tso, Pei Lum ^a   Hsu, Rick ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Chemical mechanical polishing; Compressibility; Pad; Wear

Indexed keywords

COMPRESSIBILITY; FINITE ELEMENT METHOD; MACHINE COMPONENTS; QUALITY CONTROL; WEAR OF MATERIALS;

COMPOSITE PADS; PAD WEAR; THEORETICAL MODELING;

CHEMICAL MECHANICAL POLISHING;

EID: 33947275106     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-005-0386-1     Document Type: Article

References (7)

1. Tso PL, Ho SY (2004) Study on the dressing rate of CMP pad conditioning. Key Eng Mat 257-258:377-271
2. Baker AR (1996) ECS 1996 Fall meeting, San Antonio, Texas, October 1996
3. Torquato S, Gibiansky LV, Silva MJ, Gibson LJ (1998) Effective mechanical and transport properties of cellular solids. Int J Mech Sci 40(1)::71-82
4. Zhu HX, Mills NJ (2000) The in-plane nonlinear compression of regular honeycombs. Int J Solids Struct 37(13):1931-1949
5. Sung J, Pai YL (2000) Advances in abrasive technology III. The Society of Grinding Engineers, Japan, p 189
6. van der Velden P (2000) Chemical mechanical polishing with fixed abrasives using different subpads to optimize wafer uniformity. Microelectron Eng 50(1-4):41-46
7. Preston FW (1927) The theory and design of plate glass polishing machines. J Soc Glass Tech 11:214-256