A Study on the Dressing Rate in CMP Pad Conditioning

Key Engineering Materials

Volumn 257-258, Issue , 2004, Pages 377-380

  Tso, P L ^a   Ho, S Y ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Chemical Mechanical Polishing; Dressing Rate; Pad Conditioning

Indexed keywords

DIAMONDS; OPTIMIZATION; PARAMETER ESTIMATION; PRESSURE EFFECTS; STABILITY; SURFACE ROUGHNESS; VELOCITY;

PAD CONDITIONING; POLISHING PADS;

CHEMICAL MECHANICAL POLISHING;

EID: 17644435462     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Article

References (2)

1. W. Li, D.W. Shin, M. Tomozawa and S.P. Murarka: Thin Solid Films, 1995, p. 601.
2. J. Sung, Y.L. Pai: Advances in Abrasive Technology III, The Society of Grinding Engineers, 2000, p. 189.