Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing

Key Engineering Materials

Volumn 257-258, Issue , 2004, Pages 383-388

  Kim, H ^a   Jeong, H ^a   Lee, E ^b   Shin, Y ^b  

^a Pusan National University   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

Chemical Mechanical Polishing; Friction; Pad; Surface Roughness; Tribology

Indexed keywords

FRICTION; LOADS (FORCES); PARAMETER ESTIMATION; PRESSURE EFFECTS; SURFACE ROUGHNESS; TRIBOLOGY; VELOCITY;

PLANARIZATION; RELATIVE VELOCITY;

CHEMICAL MECHANICAL POLISHING;

EID: 17644432495     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/kem.257-258.383     Document Type: Article

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