Limits of heat removal in microelectronic systems

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 4, 2006, Pages 743-749

  Miner, Andrew ^a   Ghoshal, Uttam ^b  

^a Romny Scientific   (United States)

^b Nanocoolers Inc   (United States)

Author keywords

Heat transfer; Liquid cooling; Physical limits; Thermal design; Thermal management; Thermal resistance; Thermal spreading resistance; Thermodynamic limits

Indexed keywords

HEAT RESISTANCE; INTERFACES (MATERIALS); SPECIFIC HEAT; TEMPERATURE CONTROL; THERMODYNAMICS;

LIQUID COOLING; PHYSICAL LIMITS; THERMAL DESIGN; THERMAL SPREADING RESISTANCE; THERMODYNAMIC LIMITS;

MICROELECTRONICS;

EID: 33947207985     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.885933     Document Type: Article

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