Numerical comparison of packaging technologies for power electronics modules

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 2005, Issue , 2005, Pages 2187-2193

  Cottet, Didier ^a   Hamidi, Amina ^a  

^a ABB SWITZERLAND LTD   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT SIMULATION; ELECTRIC WIRE; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); NUMERICAL ANALYSIS; POWER ELECTRONICS; SWITCHING THEORY;

ELECTRONIC MODULES; PACKAGING STRUCTURES; WIRE BONDING TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 33847726560     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2005.1581936     Document Type: Conference Paper

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