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Volumn 3, Issue , 2004, Pages 1519-1525

Inside a power module

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; INDUCTANCE; MOSFET DEVICES; NETWORKS (CIRCUITS); POWER CONVERTERS;

EID: 10944225222     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (19)

References (17)
  • 1
    • 0032310015 scopus 로고    scopus 로고
    • Low inductance, explosion robust IGBT modules in high power inverter applications
    • Oct
    • Schnur L, Debled G, Dewar S, Marous J, "Low inductance, explosion robust IGBT modules in high power inverter applications" Industry Applications Conference, Oct 1998, Volume 2, pp 1056-1060
    • (1998) Industry Applications Conference , vol.2 , pp. 1056-1060
    • Schnur, L.1    Debled, G.2    Dewar, S.3    Marous, J.4
  • 2
    • 0036250336 scopus 로고    scopus 로고
    • Original cabling conditions to insure balanced current during switching transitions between paralleled semiconductors
    • Jeannin P-O, Schanen J-L, Clavel E, "Original cabling conditions to insure balanced current during switching transitions between paralleled semiconductors", IEEE Trans IAS, pp 181-188, volume:38,2002
    • (2002) IEEE Trans IAS , vol.38 , pp. 181-188
    • Jeannin, P.-O.1    Schanen, J.-L.2    Clavel, E.3
  • 4
    • 0032316218 scopus 로고    scopus 로고
    • Optimisation of gate circuit layout to suppress power/drive interaction
    • 1998, Thirty-Third IAS Annual Meeting. The 1998 IEEE, 12-15 Oct
    • Akhbari M, Piette N, Schanen J.L, "Optimisation of gate circuit layout to suppress power/drive interaction", Industry Applications Conference, 1998, Thirty-Third IAS Annual Meeting. The 1998 IEEE, Volume: 2, 12-15 Oct 1998
    • (1998) Industry Applications Conference , vol.2
    • Akhbari, M.1    Piette, N.2    Schanen, J.L.3
  • 6
    • 10944233867 scopus 로고    scopus 로고
    • www.fujielectric.co.jp
  • 7
    • 10944266161 scopus 로고    scopus 로고
    • www.mitsubishichips.com
  • 8
    • 10944240099 scopus 로고    scopus 로고
    • www.ixys.com
  • 9
    • 10944270664 scopus 로고    scopus 로고
    • www.eupec.com
  • 10
    • 0031706383 scopus 로고    scopus 로고
    • Extraction of parasitics within wire-bond IGBT modules
    • Kun Xing, Fred C. Lee, Dushan Boroyevich, "Extraction of Parasitics within Wire-Bond IGBT Modules" APEC'98, pp497-503
    • APEC'98 , pp. 497-503
    • Xing, K.1    Lee, F.C.2    Boroyevich, D.3
  • 11
    • 34547881199 scopus 로고    scopus 로고
    • Effects of the internal layout on the performance of IGBT power modules
    • brazil
    • A. Consoli, F. Gennaro, V. John, T.A. Lipo "Effects of the Internal Layout on the Performance of IGBT Power Modules", COPEB'99, brazil, 1999
    • (1999) COPEB'99
    • Consoli, A.1    Gennaro, F.2    John, V.3    Lipo, T.A.4
  • 13
    • 0028497396 scopus 로고
    • An experimentally verified IGBT model implemented in the Saber circuit simulator
    • Sept.
    • A.R,Jr.Hefner, D.Diebolt, "An experimentally verified IGBT model implemented in the Saber circuit simulator", IEEE Transactions on Power Electronics, Volume: 9 Issue: 5, Sept. 1994 Page(s): 532 -542
    • (1994) IEEE Transactions on Power Electronics , vol.9 , Issue.5 , pp. 532-542
    • Hefner Jr., A.R.1    Diebolt, D.2
  • 14
    • 0028132467 scopus 로고
    • State variable modeling of the power pin diode using an explicit approximation of semiconductor device equations: A novel approach
    • Jan.
    • H.Morel, S.H.Gamal, J.P.Chante, "State variable modeling of the power pin diode using an explicit approximation of semiconductor device equations: a novel approach " IEEE Transactions on Power Electronics, Volume: 9 Issue: I, Jan. 1994 Page(s): 112-120
    • (1994) IEEE Transactions on Power Electronics , vol.9 , Issue.1 , pp. 112-120
    • Morel, H.1    Gamal, S.H.2    Chante, J.P.3
  • 15
    • 8744247147 scopus 로고    scopus 로고
    • Power integration: Electrical analysis of new emerging package
    • septembre 03, Toulouse, France
    • C.Martin, JL.Schanen, R.Pasterczyk "Power Integration: electrical analysis of new emerging package", EPE'03, septembre 03, Toulouse, France
    • EPE'03
    • Martin, C.1    Schanen, J.L.2    Pasterczyk, R.3
  • 16
    • 10944269831 scopus 로고    scopus 로고
    • PCIM2000, complete paper on: http://www.eupec.com/gb/2_PRODUCTS/2_6_Editorials/pdf/ed_pcim_2000_bostonf.pdf
    • PCIM2000, Complete Paper
  • 17
    • 0033316972 scopus 로고    scopus 로고
    • Thermal design and measurements of IGBT power modules: Transient and steady state
    • 1999. Thirty-Fourth IAS Annual Meeting. Conference Record of the 1999 IEEE, 3-7 Oct. vol.2
    • J. He, V. Mehrotra, M.C. Shaw, "Thermal design and measurements of IGBT power modules: Transient and steady state", industry Applications Conference, 1999. Thirty-Fourth IAS Annual Meeting. Conference Record of the 1999 IEEE,Volume: 2, 3-7 Oct. 1999 Pages: 1440 - 1444 vol.2
    • (1999) Industry Applications Conference , vol.2 , pp. 1440-1444
    • He, J.1    Mehrotra, V.2    Shaw, M.C.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.