Magnetic current imaging with magnetic tunnel junction sensors: Case study and analysis

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 2006, Issue , 2006, Pages 13-19

  Schrag, Benaiah D ^a   Carter, Matthew J ^a   Liu, Xiaoyong ^a   Hoftun, Jan S ^a   Xiao, Gang ^a  

^a Micro Magnetics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CURRENT DENSITY; FAILURE (MECHANICAL); GIANT MAGNETORESISTANCE; MAGNETIC SENSORS; SQUIDS; TUNNEL JUNCTIONS;

MAGNETIC CURRENT IMAGING; MAGNETIC TUNNEL JUNCTION (MJT); SPATIAL RESOLUTION;

IMAGING TECHNIQUES;

EID: 33847651257     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. S. Chatraphorn, E. F. Fleet, F. C. Wellstood, L. A. Knauss, and T. M. Eiles, Scanning SQUID microscopy of integrated circuits, Appl. Phys. Lett., 76, 2304 (2000).
2. D. P. Vallett, Scanning SQUID Microscopy for Die Level Fault Isolation, Proc. 28th Int. Symp. for Test. and Failure Analysis (ISTFA), Nov. 2002.
3. th Int. Symp. Test. and Failure Analysis (ISTFA), Nov. 2003.
4. B. D. Schrag, Xiaoyong Liu, J. S. Hoftun, P. L. Klinger, T. M. Levin, and D. P. Vallett, Quantitative Analysis and Depth Measurement via Magnetic Field Imaging, EDFA Magazine, Nov. 2005.
5. Xiaoyong Liu, C. Ren, and Gang Xiao, Magnetic tunnel junction sensors with hard-axis bias field, J. Appl. Phys. 92, 4722 (2002).
6. th Int. Symp. Test. and Failure Analysis (ISTFA), Nov. 2003.