Scanning SQUID microscopy of integrated circuits

Applied Physics Letters

Volumn 76, Issue 16, 2000, Pages 2304-2306

  Chatraphorn, S ^a   Fleet, E F ^a   Wellstood, F C ^a   Knauss, L A ^b   Eiles, T M ^c  

^a Bldg 142   (United States)

^b Neocera Inc   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000967076     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.126327     Document Type: Article

References (12)

1. See, for example, R. E. Anderson, J. M. Soden, and C. L. Henderson, Future Technology Challenges for Failure Analysis. International Symposium for Testing and Failure Analysis Proceedings, Santa Clara. CA (ASM International, Metals Park, OH, 1995), pp. 27-31.
2. D. P. Vallett, and J. M. Soden, IEEE Spectr. 34, 39 (1997).
3. See, for example, B. J. Roth, N. G. Sepulveda, and J. P. Wikswo, Jr., J. Appl. Phys. 65, 361 (1989).
4. J. P. Wikswo, Jr., in SQUID Sensors: Fundamentals, Fabrication and Applications, edited by H. Weinstock (Kluwer Academic, Dordrecht, The Netherlands, 1996), pp. 629-695.
5. W. H. Press, S. A. Teukolsky, W. T. Vetterling, and B. P. Flannery, Numerical Recipe in C, 2nd ed. (Cambridge University Press, New York, 1992), pp. 553-558.
6. R. C. Black, Ph.D. thesis, Department of Physics, University of Maryland, College Park, 1995.
7. Worldwide patents issued and pending, University of Maryland.
8. T. S. Lee, E. Dantsker, and J. Clarke, Rev. Sci. Instrum. 67, 4208 (1996).
9. F. C. Wellstood, Y. Gim, A. Amar, R. C. Black, and A. Mathai, IEEE Trans. Appl. Supercond. 7, 3134 (1997).
10. S. Chatraphorn, E. F. Fleet, R. C. Black, and F. C. Wellstood, Appl. Phys. Lett. 73, 984 (1998).
11. J. Clarke, in Ref. 4, pp. 1-62.
12. We note that the ripples near the current path may arise from other effects such as a slight tilt in the sensor or nonlinearity in the electronics readout.