Prediction of surface microtrenching by using neural network

Current Applied Physics

Volumn 7, Issue 4, 2007, Pages 434-439

  Kim, Byungwhan ^a   Kim, Dong Hwan ^b   Park, Jaeyoung ^c   Han, Seung Soo ^d  

^a Sejong University   (South Korea)

^b Seoul National University of Science and Technology   (South Korea)

^c Kwangwoon University   (South Korea)

^d Myong Ji University   (South Korea)

Author keywords

Computer modeling and simulation; Neural networks; Plasma etching

Indexed keywords

GENETIC ALGORITHMS; MATHEMATICAL MODELS; NEURAL NETWORKS; PLASTIC FILMS; SILICON COMPOUNDS; STATISTICAL METHODS;

FLOW RATE; MICROTRENCHING DEPTH (MD); PROCESS PARAMETERS; STATISTICAL EXPERIMENTAL DESIGNS;

PLASMA ETCHING;

EID: 33847328296     PISSN: 15671739     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cap.2006.09.018     Document Type: Article

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