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Volumn 24 II, Issue , 2004, Pages 437-440
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Characterizations of soft-gel thermal interface materials for flip chip package
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
CHIP SCALE PACKAGES;
CONDUCTIVE MATERIALS;
DELAMINATION;
ELASTIC MODULI;
FILLERS;
GEL PERMEATION CHROMATOGRAPHY;
GELS;
HEAT RESISTANCE;
INTERFACES (MATERIALS);
MICROPROCESSOR CHIPS;
PARAMETER ESTIMATION;
POLYMERS;
REFRACTOMETERS;
THERMOANALYSIS;
VISCOMETERS;
FLIP CHIP PACKAGES;
HEAT SPREADERS;
THERMAL CONDUCTIVE FILLERS;
THERMAL INTERFACES;
MICROELECTRONICS;
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EID: 3142734321
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (5)
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References (4)
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