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Volumn 24 II, Issue , 2004, Pages 437-440

Characterizations of soft-gel thermal interface materials for flip chip package

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHIP SCALE PACKAGES; CONDUCTIVE MATERIALS; DELAMINATION; ELASTIC MODULI; FILLERS; GEL PERMEATION CHROMATOGRAPHY; GELS; HEAT RESISTANCE; INTERFACES (MATERIALS); MICROPROCESSOR CHIPS; PARAMETER ESTIMATION; POLYMERS; REFRACTOMETERS; THERMOANALYSIS; VISCOMETERS;

EID: 3142734321     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (5)

References (4)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.