Development of BGA solution for the IBM PowerPC 970 module in apple's power mac G5

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 407-412

  Edwards, David ^a   Chambers, Hope ^b   Farooq, Mukta ^a   Goldmann, Lewis ^a   Salehi, Amir ^b  

^a IBM MICROELECTRONICS   (United States)

^b APPLE INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY (BGA); HEATSINK DESIGN; ORGANIC PROCESSOR BOARD; THERMO-MECHANICAL INTEGRITY;

CLAMPING DEVICES; COMPRESSIVE STRENGTH; ELECTRONICS PACKAGING; RISKS; STRAIN; THERMAL EXPANSION;

MICROPROCESSOR CHIPS;

EID: 10444254634     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. "Power Mac G5: Technology and Performance Overview, November 2003" White Paper, Apple Computer November 2003.
2. K.C. Norris and A.H. Landzberg, "Reliability of Controlled Collapse Interconnections," IBM Journal of Research and Development, Vol. 13, No. 3, May 1969, pp. 266-271.
3. M.Farooq, C.Goldsmith, R.Jackson, G.Martin, "Lead-Free Ceramic Ball Grid Array: Thermomechanical Fatigue Reliability", Journal of Electronic Materials, Vol.32, No. 12, December 2003.
4. L. Goldmann and M. Farooq, "Creep Characterization of Ceramic Ball Grid Array," to be published. Please contact authors for further information.