Development of the wafer level compressive-flow underfill process and its involved materials

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 4, 1999, Pages 249-250

  Shi, Songhua ^a   Yamashita, T ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

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EID: 33748091355     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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