Parameter optimization for an ICP deep silicon etching system

Microsystem Technologies

Volumn 13, Issue 5-6, 2007, Pages 465-474

  Chen, S C ^a   Lin, Y C ^a   Wu, J C ^a   Horng, L ^a   Cheng, C H ^b  

^a NATIONAL CHANGHUA UNIVERSITY OF EDUCATION   (Taiwan)

^b DA YEH UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; OPTIMIZATION; PARAMETER ESTIMATION; PRESSURE EFFECTS;

GAS PRESSURE; NANO-SIZED ETCHING; TAGUCHI EXPERIMENTAL METHOD;

REACTIVE ION ETCHING;

EID: 33847261978     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0211-2     Document Type: Article

References (9)

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