Numerical analysis by 3D finite element wire bond simulation on Cu/low-K structures

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 215-220

  Viswanath, Akella G K ^a   Fang, Wang ^a   Zhang, Xiaowu ^b   Ganesh, V P ^b   Lim, L A ^c  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c ASM Technology   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; ELECTRIC WIRE; FINITE ELEMENT METHOD; PARAMETER ESTIMATION;

BOND PAD; BONDING PROCESSES; INTERFACIAL DEFORMATION;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 33847254993     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/eptc.2005.1614396     Document Type: Conference Paper

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