Process technique for singulating fragile devices

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 716-719

  Agarwal, Ajay ^a   Mohanraj, S ^a   Premachandran, C S ^a   Singh, Janak ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; SILICON WAFERS;

DICING SAW; FRAGILE DEVICES; MICRO ELECTRO MECHANICAL SYSTEMS (MEMS);

MICROELECTROMECHANICAL DEVICES;

EID: 33847251143     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Pai-Hsiang Kao, Ranjan J. Mathew, and Cornelio De Vera, Method and Apparatus for Singulation of Micro-electro-mechanical Systems, US Patent # 5,923, 995, 1999.
2. Timothy R. Spooner and Kieran P. Harney, Method and Device for Protecting Micro Electromechanical System Structures during Dicing of a Wafer, US Patent # 6,555,417, 2003.
3. David Xuan-Qi Wang and Jason Yao, Low Defect Method for Die Singulation and for Structural Support for Handling Thin Film Devices, US Patent # 6,573,156B1, 2003.
4. Minh Van Le and Jo-Ey Wong, Optical membrane Singulation process utilizing backside and frontside protective coating during die saw, US patent application # US 2002/ 0106871 A1.
5. J. Aberson, P. Cusin, J. Wylde, R. Hickey, and H. Fettig, Novel Backend Singulation Techniques to Enable Commercialization of Optical MEMS, Proc. of the Intl. Conf. on MEMS, NANO and Smart Systems (ICMENS'03), 20-23 July 2003, pp. 131.
6. Y. Awatani, Y. Matsumoto, and K. Kato, Damage free dicing method for MEMS devices, Intl. Conf. on Optical MEMS, Conference Digest 2002 IEEE/ LEOS, 20-23 Aug. 2002, pp. 137-138.
7. Michael B. Cohn, R. Roehnelt, Ji-Hai Xu, A. Shteinberg, and S. Cheung, MEMS packaging on a budget (fiscal and thermal), Proc. of 9th Intl. Conf. on Electronics, Circuits and Systems, vol. 1, 15-18 Sept. 2002, pp. 287-290.
8. Janak Singh, Zeng Wenjiang, Ajay Agarwal, 2D and 3D SCS Micro Mirror Devices Using Polysilicon Comb Drive Process, The 16th European Conference on Solid-State Transducers, Sept. 15-18, 2002, Prague, Czech Republic, pp. 197-200.
9. Janak Singh, Zeng Wenjiang, Ajay Agarwal, A Novel Process to Obtain a Micro Mirror Optical Switching Device, The 16th European Conference on Solid-State Transducers, Sept. 15-18, 2002, Prague, Czech Republic, pp. 201-204.
10. Ajay Agarwal, T. Gan, J. Singh, Y. K. Hoh and Andrew A. O. Tay, Study on Bimorph and Multimorph Microactuators, International Journal of Computational Engineering Science, vol. 4, no. 2 (June 2003), Special Issue on Microelectromechanical Systems (ICMAT 2003; Singapore), p. 215-219.