An efficient method for assessing board level reliability for micro-electronic packages using combined experimental - Numerical techniques

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Jansen, M Y ^a   De Vries, J W C ^a   Van Driel, W D ^b,c  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; PRINTED CIRCUIT BOARDS; THERMAL CYCLING; TRANSIENTS;

MICRO-ELECTRONIC PACKAGES; THERMAL CYCLE TEST; THERMAL SHOCK TESTS;

ELECTRONICS PACKAGING;

EID: 33847125375     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1643982     Document Type: Conference Paper

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