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Volumn 2005, Issue , 2005, Pages 146-155
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Burn-in reduction using principal component analysis
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Author keywords
[No Author keywords available]
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Indexed keywords
BURN-IN REDUCTION SCREEN;
DIE PASSING;
DATA REDUCTION;
RELIABILITY;
SILICON WAFERS;
SORTING;
PRINCIPAL COMPONENT ANALYSIS;
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EID: 33847109705
PISSN: 10893539
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/TEST.2005.1583971 Document Type: Conference Paper |
Times cited : (29)
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References (10)
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