Brittle and ductile fracture mechanics analysis of surface damage caused during CMP

Journal of the Electrochemical Society

Volumn 154, Issue 3, 2007, Pages

  Ring, Terry A ^a   Feeney, Paul ^b   Boldridge, David ^b   Kasthurirangan, Jaishankar ^b   Li, Shoutian ^b   Dirksen, James A ^b  

^a Department of Electrical and Computer Engineering   (United States)

^b CABOT MICROELECTRONICS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; CHEMICAL MECHANICAL POLISHING; DIELECTRIC MATERIALS; DUCTILE FRACTURE; FRACTURE MECHANICS; MICROPROCESSOR CHIPS; MULTILAYERS;

CHATTER MARKS; ROLLING INDENTER; SURFACE DAMAGE; SURFACE FLAKING; WAFER SURFACE;

SURFACE PHENOMENA;

EID: 33846980503     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2426877     Document Type: Article

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