Graphite foam thermal management of a high packing density array of power amplifiers

Journal of Electronic Packaging

Volumn 128, Issue 4, 2006, Pages 456-465

  Williams, Z A ^a,b   Roux, J A ^a,c  

^a ASME

^b Ducommun Incorporated   (United States)

^c The University of Mississippi   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; ENERGY DISSIPATION; FOAMS; GRAPHITE; HEAT EXCHANGERS; HEAT TRANSFER; MICROPROCESSOR CHIPS; PRESSURE DROP; THERMAL EFFECTS;

COOLING CHANNEL; GRAPHITE FOAMS; HIGH PACKING DENSITY ARRAY; SOFTWARE PACKAGES; THERMAL MANAGEMENT;

POWER AMPLIFIERS;

EID: 33846670852     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2353282     Document Type: Article

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