Optimization study for a parallel plate impingement heat sink

Journal of Electronic Packaging

Volumn 128, Issue 4, 2006, Pages 311-318

  Shah, Amit ^a   Sammakia, Bahgat G ^b   Srihari, K ^b   Ramakrishna, K ^c,d  

^a General Electric Company India   (India)

^b State University of New York at Binghamton   (United States)

^c ASME

^d FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINS (HEAT EXCHANGE); HYDRAULIC CONTROL EQUIPMENT; OPTIMIZATION; PRESSURE DROP; THERMAL EFFECTS;

FAN OPERATING CHARACTERISTICS; FIN MATERIALS; HEAT SINK GEOMETRIES;

HEAT SINKS;

EID: 33846661416     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2351893     Document Type: Article

References (8)

1. Sathe, S., and Sammakia, B., 2004, "An Analytical Study of the Optimized Performance of an Impingement Heat Sink," ASME I. Electron. Packag., 126(4), pp. 528-534.
2. Shah, A., Sammakia, B., Ramakrishna, K., and Srihari, H., 2002, "A Numerical Study of the Thermal Performance of an Impingement Heat Sink-Fin Shape Optimization," Proc. of ITherm 2002: Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, May 30-June 1, C. H. Amon, K. Ramakrishna, B. G. Sammakia, G. Subbarayan, S. B. Sathe, and Y. K. Joshi, eds., IEEE CPMT Soc., San Diego, pp. 296-306.
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7. Ramakrishna, K., and Lee, T. Y., 2001, "Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Part 1: Effect of Dje Sizes," Proceedings-ASME International Mechanical Engineering Congress and Exposition, Heat Transfer Division, New York, ASME, New York, pp. 1-9.
8. Flomerics, 2001, FLOTHERM™ Instruction Manual, Flomerics Ltd., Surrey, UK.