An analytical study of the optimized performance of an impingement heat sink

Journal of Electronic Packaging

Volumn 126, Issue 4, 2004, Pages 528-534

  Sathe, S B ^a   Sammakia, B G ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER WORKSTATIONS; COOLING SYSTEMS; ELECTRONICS PACKAGING; HEAT RESISTANCE; HEAT TRANSFER; JETS; PRESSURE EFFECTS; REDUCTION; THERMAL CONDUCTIVITY; THICKNESS MEASUREMENT; VISCOSITY;

DYNAMIC VISCOSITY; FIN THICKNESS; FLUID VELOCITY; THERMAL MANAGEMENT;

HEAT SINKS;

EID: 13944275677     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1827269     Document Type: Article

References (14)

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