The influence of porosity on whisker growth in electroplated tin films

Journal of Materials Research

Volumn 21, Issue 12, 2006, Pages 2971-2974

  Winterstein, J P ^a   Norton, M G ^a  

^a Washington State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; ELECTROPLATED PRODUCTS; FILM GROWTH; METALLOGRAPHIC MICROSTRUCTURE; POROSITY; SOLDERING ALLOYS;

TIN FILMS; TIN SOLDERS; WHISKER GROWTH;

TIN;

EID: 33846332741     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0368     Document Type: Article

References (19)

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