Minimization of tin whisker formation for lead-free electronics finishing

Circuit World

Volumn 27, Issue 2, 2001, Pages 17-20

  Schetty, R ^a  

^a SHIPLEY COMPANY   (United States)

Author keywords

Electroplating; Finishing; Whisker formation

Indexed keywords

CRYSTAL WHISKERS; CURRENT DENSITY; ELECTROPLATING; FINISHING; LEAD; MICROELECTRONICS; SCANNING ELECTRON MICROSCOPY;

ELECTRONICS FINISHING; WHISKER FORMATION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0034921084     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120110367131     Document Type: Article

References (13)

1. Metal whiskers - a factor in design
2. Tin whiskers: Mechanisms of growth and prevention
3. A proposed mechanism for metallic whisker growth
4. Lead free tin alloys as substitutes for tin-lead alloy plating
5. Grain size effect of electroplated tin coatings on whisker growth
6. Pb-free component finishes
7. An alternative surface finish for tin-lead solders
8. Electroplated tin and the whisker phenomenon