SCOPUS 정보 검색 플랫폼

Metal Finishing

Volumn 101, Issue 1, 2003, Pages 8-16

Lead-free tin alloys - Laboratory curiosities or capable processes?

(1) Jordan, Manfred a

a Max Schlötter GmbH (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH; COPPER; DEPOSITION; ELECTROCHEMISTRY; ELECTROLYTES; ELECTRONIC EQUIPMENT; LEAD DEPOSITS; REACTION KINETICS; SILVER; SOLDERING ALLOYS; TITRATION;

CODEPOSITION; IMMERSION PLATING; MATTE TIN; TIN-LEAD DEPOSITS;

TIN;

EID: 0742330846 PISSN: 00260576 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-0576(03)80004-1 Document Type: Article

Times cited : (5)

References (16)

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- Williams, M., IPC/NEMI Symposium on Lead-Free Electronics; Sept. 18-19, 2002
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- Williams, M.¹

2
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- Studies of electroplated tin-coatings for the electronic industry in connection with whisker formation
- Nov.
- Hilbert, F. and P. Kuhlkamp, Studies of Electroplated Tin-Coatings for the Electronic Industry in Connection with Whisker Formation, Proceedings Oberflachentage; Nov. 2002
- (2002) Proceedings Oberflachentage
- Hilbert, F.¹ Kuhlkamp, P.²

3
- 33645249977
- Kuhl, R. and S. Mills, Surface Mount Technology, 6:48; 1995
- (1995) Surface Mount Technology , vol.6 , pp. 48
- Kuhl, R.¹ Mills, S.²

4
- 0000168193
- Kakeshita, T. et al., J. Mat. Sci., 17:2560; 1982
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- Kakeshita, T.¹

5
- 33645251562
- An alternative surface finish for SnPb solders: Pure tin
- June
- Zhang, Y. and J.A. Abys, An Alternative Surface Finish for SnPb Solders: Pure Tin, Proc. Annual Conference American Electroplaters and Surface Finishers Society; June 1966
- (1966) Proc. Annual Conference American Electroplaters and Surface Finishers Society
- Zhang, Y.¹ Abys, J.A.²

6
- 33645270958
- Jordan, M. and R. Lawson, Trans. IMF, 78:B82; 2000
- (2000) Trans. IMF , vol.78
- Jordan, M.¹ Lawson, R.²

7
- 33645259550
- January
- N. N, European Semiconductor, 10; January 2001
- (2001) European Semiconductor , vol.10

8
- 0036577278
- Jordan, M., Trans. IMF, 80(3):97; 2002
- (2002) Trans. IMF , vol.80 , Issue.3 , pp. 97
- Jordan, M.¹

9
- 33645265620
- Top Three European Semiconductor Manufacturers Announce Initiative to Eliminate Lead from Semiconductor Products, http://www.infineon.com/green-product/download/all_comments.pdf
- Top Three European Semiconductor Manufacturers Announce Initiative to Eliminate Lead from Semiconductor Products

10
- 0142203669
- CALCE-EPSC
- Osterman, M., CALCE-EPSC, Mitigation Strategies for Tin Whiskers, http://www.calce.umd.edu/lead-free/tinwhiskers/Tinwiskeralert.pdf
- Mitigation Strategies for Tin Whiskers
- Osterman, M.¹

11
- 20444411661
- Whisker formation on electroplated Sn-Cu
- Williams, M.E. et al., Whisker Formation on Electroplated Sn-Cu, Proc. AESF SUR/FIN; 2002
- (2002) Proc. AESF SUR/FIN
- Williams, M.E.¹

12
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- Tin whisker studies-experimentation & mechanistic understanding
- Schetty, R., Tin Whisker Studies-Experimentation & Mechanistic Understanding, Proc. AESF SUR/FIN 2002
- Proc. AESF SUR/FIN 2002
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13
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- www.infineon.com/greenproduct/solderability.htm

14
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- www.oki.com/semi/datadocs/doc-eng/otr-188-10.pdf

15
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- Reger, H. and N. Maser, Proceedings Oberflachentage 97; 2002
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- Reger, H.¹ Maser, N.²

16
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- Tin whisker observations on pure tin-plated ceramic chip capacitors
- Brusse, J., Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors, Proc. AESF SUR/FIN 2002
- Proc. AESF SUR/FIN 2002
- Brusse, J.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.