AlSiC, and AlSiC hybrid composites for flip chips, optoelectronics, power, and high brightness LED thermal management solutions

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Occhionero, Mark A ^a   Adams, Richard W ^a  

^a CPS Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM SILICON CARBIDE (ALSIC); THERMAL EXPANSION COEFFICIENT (TCE); THERMAL PYROLYTIC GRAPHITE (TPG);

CHEMICAL VAPOR DEPOSITION; COMPUTER SIMULATION; FLIP CHIP DEVICES; HEAT LOSSES; LIGHT EMITTING DIODES; STEEL STRUCTURES;

METALLIC MATRIX COMPOSITES;

EID: 33846313593     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564720     Document Type: Conference Paper

References (4)

1. M.A.Occhionero, AlSiC Microprocessor Lids Handle the Heat, Surface Mount Technology, 2005, Vol 19, Number 6, 32-37.
2. MA. Occhionero, R.W. Adams, Aluminum Silicon Carbide Microprocessor and Flip Chip Lids for Integrated Thermal Management, Materials Engineering News, 2005, Vol 1, Issue 1, 14-15.
3. T. Schuetze, H. Berg, O. Schilling "The New 6.5kV IGBT Module: a Reliable Device for Medium Voltage Applications", PCIM Conference Proceedings September 2001.
4. th European, Microelectronics and Packaging Conference Brugge Belgium, IMAPS, 69-73