AlSiC microprocessor lids handle the heat

SMT Surface Mount Technology Magazine

Volumn 19, Issue 6, 2005, Pages 32-37

  Occhionero, Mark A ^a  

^a Ceramic Process Systems (CPS)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC OXIDATION; CHEMICAL VAPOR DEPOSITION; CONCENTRATION (PROCESS); HEAT SINKS; METAL CASTING; MICROPROCESSOR CHIPS; POROSITY; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICES; SILICON CARBIDE; STRENGTH OF MATERIALS; THERMAL CONDUCTIVITY; THERMAL STRESS;

ALUMINUM SILICON CARBIDE (ALSIC); MICROPROCESSOR DEVICES; PEDESTALS; THERMAL MANAGEMENT;

METALLIC MATRIX COMPOSITES;

EID: 21644468865     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (3)

1. T. Schuetze, H. Berg, O. Schilling "The New 6.5-kV IGBT Module: A Reliable Device for Medium Voltage Applications" PCIM Power Electronic Systems, p. 39-46, Vol 27, No 9, September 2001.
2. Mark A. Occhionero, Robert A. Hay, Richard W. Adams, and Kevin P. Fennessy, "Aluminum Silicon Carbide (AlSiC) Microprocessor Lids and Heat Sinks for Integrated Thermal Management Solutions" presented at the 2000 HDI Conference in Denver, Colo., April 25-28, 2000.
3. th European Microelectronics and Packaging Conference, June 7-9, 1999, S10-04.