Properties evaluation of AlSiC TPG test product

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings

Volumn , Issue , 2005, Pages 69-73

  Occhionero, Mark A ^a   Adams, Richard W ^a  

^a Ceramics Process Systems   (United States)

Author keywords

Flip chip lid; Heat spreading; Thermal conductivity; Thermal expansion coefficient; Thermal management; Thermal pyrolytic graphite

Indexed keywords

ALUMINUM COATED STEEL; ALUMINUM COMPOUNDS; CASTING; CHEMICAL BONDS; CHIP SCALE PACKAGES; COST EFFECTIVENESS; EXPANSION; FLIP CHIP DEVICES; GRAPHITE; INTEGRATION; METALLIC MATRIX COMPOSITES; MICROELECTRONICS; SILICON CARBIDE; TEMPERATURE CONTROL; THERMAL EXPANSION; THERMAL MANAGEMENT (ELECTRONICS);

ALUMINUM SILICON CARBIDE; ELECTRONICS APPLICATIONS; ELECTRONICS THERMAL MANAGEMENTS; FLIP CHIP; HEAT SPREADING; HIGH THERMAL CONDUCTIVITY; PYROLYTIC GRAPHITE; THERMAL EXPANSION COEFFICIENTS;

THERMAL CONDUCTIVITY;

EID: 33846299668     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Mark A. Occhionero, Robert A. Hay, Richard W. Adams, and Kevin P. Fennessy, "Aluminum Silicon Carbide (AlSiC) Microprocessor Lids and Heat Sinks for Integrated Thermal Management Solutions" presented at the 2000 HDI Conference in Denver Colorado April 25-28th
2. T. Schuetze, H. Berg, O. Schilling "The New 6.5kV IGBT Module: a Reliable Device for Medium Voltage Applications", PCIM September 2001.
3. th European Microelectronics and Packaging Conference, June 7-9, 1999, S10-04.
4. Mark A. Occhionero, Richard W. Adams, Kevin P. Fennessy, and Glenn Sundberg, "AlSiC Baseplates for Power IGBT Modules: Design, Performance and Reliability" presented at PCIM 2001 Europe June 19-21, 2001 Nuremberg Germany (available on the internet at http://www.alsic.com/papers/cps-igbt-2001.pdf)
5. Barry Berenberg, "Metal Matrix Composites Advanced Optoelectronic Packaging Design", High Performance Composites, pp 44-46, Volume 11, No. 5, 2003.