Sn-Zn eutectic alloy soldering in a low oxygen atmosphere

Proceedings - 2nd International Symposium on Environmentally Conscious Design and Inverse Manufacturing

Volumn , Issue , 2001, Pages 1055-1058

  Tadauchi, M ^a   Komatsu, I ^a   Tateishi, H ^a   Teshima, K ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BINS; EUTECTICS; LEAD-FREE SOLDERS; MANUFACTURE; MECHANICAL VARIABLES MEASUREMENT; OXYGEN; SOLDERING; SOLDERING ALLOYS; SYSTEMS (METALLURGICAL); TIN; WETTING; ZINC; ZINC ALLOYS;

BINARY SYSTEMS; EUTECTIC ALLOYS; EUTECTIC POINTS; LEAD-FREE SOLDERING; LOW OXYGEN; TIN LEAD ALLOYS; TIN-ZINC ALLOYS; WETTING PROPERTY;

ALLOYS;

EID: 84963669786     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECODIM.2001.992521     Document Type: Conference Paper

References (5)

1. T.Kawaguchi, Journal of SHM, 11,3,(1995), 10
2. T. Takemoto, The Forum for Environmental Protection on the Electronics Packaging Technologies, (May, 1997), 1-1
3. S. Hwang, Circuits Assembly, Oct. (1993), 32
4. H. Manko, Solders and Soldering (Second Edition), McGraw-Hill Book Company, (1979), 125
5. I. Komatsu, M. Tadauchi, and M. Mukai, Microelectronics Symposium (MES'98), (1998), 93