3D pattern effects in RTA radiative vs conductive heating

ECS Transactions

Volumn 3, Issue 2, 2006, Pages 85-96

  Granneman, E H A ^a   Terhorst, H ^a   Funk, K ^a   Falepin, A ^b   Rosseel, E ^b   Verheyden, K ^c   Vanormelingen, K ^c   Bourdon, H ^d   Halimaoui, A ^d  

^a ASM Europe BV   (Netherlands)

^b IMEC   (Belgium)

^c ASM BELGIUM   (Belgium)

^d STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; RADIANT HEATING; THERMAL EFFECTS; TRENCHING;

CONDUCTION HEATING; DIE TEMPERATURE; HEAT-UP RATES; LAMP-BASED SYSTEMS;

SILICON;

EID: 33846224236     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2356267     Document Type: Conference Paper

References (7)

1. Th. Feudel, M. Horstmann, D. Greenlaw, M. Raab, 'Junction scaling for next generation Microprocessor Technol.' Semicon-Europe Techn. Symp, March 2005.
2. I Ahsan, N. Zamdmer, O. Glushchenkov, R. Logan, E.J. Nowak, H. Kimura, J. Zimmerman, G. Berg, J. Herman, E. Maciejewski, A. Chan, A. Azuma, S. Deshpande, B. Dirahoui, G. Freeman, A. Gabor, M. Gribelyuk, S. Huang, M. Kumar, K. Miyamoto, D. Mocuta, A. Mahorowale, E. Leobandung, H. Utomo, B. Walsh. 'RTA-driven intra-die variations in stage delay, and parametric sensitivities for 65nm technology', IEEE 2006 Symposium on VLSI technology.
3. L.H. Nguyen, W. Dietl, J. Nieb, Z. Nenyei; RTP 1999 Conf. Colorado Springs, p26.
4. R. Bremensdorfer, S. Marcus, Z. Nényei; Mat. Res. Soc. Symp. Prc. 429, 327 (1996)
5. rd ECS meeting, Paris, April 2003.
6. V.I. Kuznetsov, A.B. Storm, G.J. Snijders, C. de Ridder, T.A.M. Ruijl, J.C.G. van der Sanden, E.H.A. Granneman, Int. Symposium on Rapid Thermal and other Short-time Proc. ' ECS proc. 2000-9, p401.
7. J.R. Howell, 'A Catalog of Radiation Configuration Factors', McGraw-Hill Book Company, new York, 1982.