Thin film aluminum-gold interface interactions

Scripta Materialia

Volumn 56, Issue 6, 2007, Pages 549-552

  Xu, C ^a   Sritharan, T ^a   Mhaisalkar, S G ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Intermetallic compounds; Secondary ion mass spectroscopy (SIMS); Thin films

Indexed keywords

ALUMINUM; ANNEALING; DIFFUSION; GOLD; INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE; SECONDARY ION MASS SPECTROMETRY; X RAY DIFFRACTION;

INTERFACE INTERACTIONS; INTERFACE MICROSTRUCTURES; INTERFACE TRACKING; INTERMETALLIC THICKNESS;

THIN FILMS;

EID: 33846049631     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.09.038     Document Type: Article

References (15)

1. Iida A., and Nakamura S. Jpn. J. Appl. Phys. 36 (1997) 3655
2. Passagrilli C., Gobbato L., and Tiziani R. Microelectron. Reliab. 42 (2002) 1523
3. Uno T., and Tatsumi K. Microelectron. Reliab. 40 (2000) 145
4. Y. Kizaki, M. Mori, M. Saito, in: Proc. IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 1995, pp. 105-108.
5. Weaver C., and Parkinson D.T. Philos. Mag. 22 (1970) 377
6. Fouracre R.A. Thin Solid Films 135 (1986) 189
7. Francombe M.H., Noreika A.J., and Takei W.J. Thin Solid Films 1 (1967-1968) 353
8. Campisano S.U., Foti G., Rimini E., Lau S.S., and Mayer J.W. Philos. Mag. 31 (1975) 903
9. Majni G., Nobili C., Ottaviani G., and Costato M. J. Appl. Phys. 52 (1981) 4047
10. Weaver C., and Brown L.C. Philos. Mag. 7 (1961) 1
11. Noolu N., Murdeshwar N., Ely K., Lippold J., and Baeslack III W. J. Electron. Mater. 33 (2004) 340
12. Philofsky E. Solid State Electron. 13 (1970) 1391
13. Majni G., and Ottaviani G. J. Cryst. Growth 47 (1979) 583
14. Pretorius R., Vredenberg A.M., and Saris F.W. J. Appl. Phys. 70 (1991) 3636
15. Pretorius R., Theron C.C., Vantomme A.C., and Mayer J.C. Critical Rev. Solid State Mater. Sci. 24 (1999) 1