The effects of diffusion coefficient on the etching process of sacrificial oxide layers

Thin Solid Films

Volumn 515, Issue 5, 2007, Pages 3065-3072

  Jin, Zhonghe ^a   Wu, Changju ^a   Ma, Huilian ^a   Xu, Ningning ^a   Wang, Yuelin ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Diffusion coefficient; etch rate; Micro electro mechanical systems; sacrificial oxide

Indexed keywords

ETCHING; HYDROFLUORIC ACID; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES;

ETCH RATE; SACRIFICIAL OXIDES;

DIFFUSION;

EID: 33845949783     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.08.024     Document Type: Article

References (14)

1. Bustillo J.M., Howe R.T., and Muller R.S. Proc. IEEE 86 (1998) 1552
2. Rabinovich V.L., Gupta R.K., and Senturia S.D. 9th Int. Conf. on Solid State Sensors and Actuators, Chicago, U. S. A., June 16-19, 1997 vol. 2 (1997) 1125
3. Ouborg W.J., Myung N., Nobe K., and Judy J.W. Electrochem. Soc. Proc. 27 (2002) 201
4. Matamis G., Gogoi B., Monk D., McNeil A., and Burrows V. Proc. SPIE 4174 (2000) 267
5. Eaton W.P., Jarecki R.L., and Smith J.H. 9th Int. Conf. on Solid State Sensors and Actuators, Chicago, U. S. A., June 16-19, 1997 vol. 1 (1997) 249
6. D.J. Monk, Ph.D. Thesis, University of California at Berkeley, 1993.
7. Liu J.Q., Tai Y.C., Lee J., Pong K.C., Zohar Y., and Ho C.H. Proc. IEEE (1993) 71
8. Eaton W.P., Smith J.H., and Jarecki R.L. Proc. SPIE 2879 (1996) 80
9. Blumberg A.A. J. Phys. Chem. 63 (1959) 1129
10. Blumberg A.A., and Stravrinou S.C. J. Phys. Chem. 64 (1960) 1438
11. Tai Y.C., and Ho C.M. Proc. SPIE 2448 (1995) 141
12. Reid R.C. The Properties of Gases and Liquids (1986), McGraw-Hill Publishing Company, New York 566
13. Gordon A.R. J. Chem. Phys. 5 (1937) 522
14. Harned H.S., and Owen B.B. The Physical Chemistry of Electrolytic Solutions (1950), Reinhold publishing corporation, New York