Low cost 60 GHz Gb/s radio development

PIERS 2006 Cambridge - Progress in Electromagnetics Research Symposium, Proceedings

Volumn , Issue , 2006, Pages 483-484

  Pinel, S ^a   Lee, C H ^a   Sarkar, S ^a   Perumana, B ^a   Padvanama, S ^a   Mukhopadhyay, R ^a   Laskar, J ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; LIQUID CRYSTAL POLYMERS; MILLIMETER WAVES;

BROADBAND WIRELESS COMMUNICATIONS; DATA RATES; LOW COSTS; MILLIMETER-WAVE RADIO; ORGANIC LIQUID; PROCESS TECHNOLOGIES; WIRELESS SYSTEMS;

SI-GE ALLOYS;

EID: 33845877818     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2529/piers050830163108     Document Type: Conference Paper

References (7)

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2. Ohata, K., et al., "Wireless 1.25 Gb/s transceiver modules utilizing multilayer co-fired ceramic technology," ISSCC Digest, 7-9, Feb. 2000.
3. Jagannathan, B., et al., "Self aligned SiGe NPN transistors with 285 GHz fmax and 207 GHz Ft in a manufacturable technology," IEEE Electron Device Letters, Vol. 23, 258-260, Issue: 5, May 2002.
4. Reynolds, S. K., B. A. Floyd, and T. Zwick, "60 GHz transceiver circuits in SiGe bipolar technology," IEEE ISSCC Dig. Tech. Papers, 442-443, Feb. 2004.
5. Ferndahl, M., H. Zirath, et al., "CMOS MMICs for microwave and millimeter wave applications," Microwaves, Radar and Wireless Communications, MIKON-2004. 15th, International Conference on, Vol. 1, No. 17-19, 247-248, May 2004.
6. Winkler, W., J. Borngraber, B. Heinemann, and P. Weger, "60 GHz and 76 GHz oscillators in 0.25/spl mu/m SiGe:C BiCMOS," Solid-State Circuits Conference, Digest of Technical Papers. ISSCC, 2003 IEEE International, 454-507, 2003.
7. Tentzeris, M. M., J. Laskar, J. Papapolymerou, S. Pinel, V. Palazzari, R. Li, G. de Jean, N. Papageorgiou, D. Thompson, R. Bairavasubramanian, S. Sarkar, and J.-H. Lee, "3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology," IEEE Transactions on Advanced Packaging and Manufacturing Technology, Vol. 27, 332-340, Issue: 2, May 2004.