Interfacial phenomena in thermally sprayed multiwalled carbon nanotube reinforced aluminum nanocomposite

Acta Materialia

Volumn 55, Issue 3, 2007, Pages 1059-1066

  Laha, T ^a   Kuchibhatla, S ^b   Seal, S ^b   Li, W ^c   Agarwal, A ^a  

^a The Department of Electrical and Computer Engineering   (United States)

^b University of Central Florida   (United States)

^c FLORIDA INTERNATIONAL UNIVERSITY   (United States)

Author keywords

Aluminum alloy; interfacial wetting; Metal matrix composite (MMC); Multiwalled carbon nanotube; Thermal spraying

Indexed keywords

ALUMINUM ALLOYS; CARBON NANOTUBES; DEPOSITION; INTERFACES (MATERIALS); METALLIC MATRIX COMPOSITES; REINFORCEMENT;

INTERFACIAL WETTING; MULTIWALLED CARBON NANOTUBES; OXYFUEL SPRAYED COMPOSITES; THERMAL SPRAYING;

NANOSTRUCTURED MATERIALS;

EID: 33845866613     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2006.09.025     Document Type: Article

References (63)

1. Treacy M.M.J., Ebbesen T.W., and Gibson J.M. Nature 381 (1996) 678
2. Thostenson E.T., Ren Z., and Chou T.W. Comput Sci Technol 61 (2001) 1899
3. Lu J.P. J Phy Chem Solids 58 (1997) 1649
4. Mamalis A.G., Vogtländer L.O.G., and Markopoulos A. Precision Eng 28 (2004) 16
5. Pipes R.B., and Hubert P. Compos Sci Technol 62 (2002) 419
6. Lau K.T., and Hui D. Composites: Part B 33 (2002) 263
7. Mauron Ph., Emmenegger Ch., Züttel A., Nützenadel Ch., Sudan P., and Schlapbach L. Carbon 40 (2002) 1339
8. Desai A.V., and Haque M.A. Thin-Walled Struct 43 (2005) 1787
9. Ajayan P.M., Schadler L.S., Giannaris C., and Rubio A. Adv Mater 12 (2002) 750
10. Wong M., Paramsothy M., Xu X.J., Ren Y., Li S., and Liao K. Polymer 44 (2003) 7757
11. Koerner H., Price G., Pearce N.A., Alexander M., and Vaia R.A. Nat Mater 3 (2004) 115
12. Schadler L.S., Giannaris S.C., and Ajayan P.M. Appl Phys Lett 73 (1998) 3842
13. Wood J.R., Zhao Q., and Wagner H.D. Composites: Part A 32 (2001) 391
14. Kymakis E., Alexandou I., and Amaratunga G.A.J. Synth Met 127 (2002) 59
15. Szleifer I., and Yerushalmi-Rozen R. Polymer 46 (2005) 7803
16. Lefrant S., Baltog I., Chapelle M.L., Baibarac M., Louarn G., Journet C., et al. Synth Met 100 (1999) 13
17. Kuzumaki T., Miyazawa K., Ichinose H., and Ito K. J Mater Res 13 (1998) 2445
18. Zhong R., Cong H., and Hou P. Carbon 41 (2003) 848
19. Carreño-Morelli E., Yang J., Couteau E., Hernadi K., Seo J.W., Bonjour C., et al. Phys Status Solidi 201 (2004) R53
20. Kuzumaki T., Ujiie O., and Ichinose H Ito K. Adv Eng Mater 2 (2000) 416
21. Dong S., Tu J., and Zhang X. Mater Sci Eng A 313 (2001) 83
22. Tu J., Zhu L., Chen W., Zhao X., Liu F., and Zhang X. Trans Nonfer Met Soc China 14 (2004) 880
23. Chen W.X., Tu J.P., Wang L.Y., Gan H.Y., Xu Z.D., and Zhang X.B. Carbon 41 (2003) 215
24. Chen X., Xia J., Peng J., Li W., and Xie S. Compos Sci Technol 60 (2000) 30
25. Laha T., Agarwal A., McKechnie T., and Seal S. Mater Sci Eng A 381 (2004) 249
26. Laha T., Liu Y., and Agarwal A. J Nanosci Nanotech 7 (2007) 1
27. Schwartz M.M. Composite materials. Processing, fabrication and application vol. II (1997), Prentice-Hall, Englewood Cliffs (NJ) p. 143
28. Donaldson S.L., and Miracle D.B. Metal handbook: composites vol. 21 (2001), ASM international, Materials Park (OH)
29. Andrews R., and Weisenberger M.C. Curr Opin Solid State Mater Sci 8 (2004) 31
30. Asthana R. Metal Trans A 25A (1994) 225
31. Delannay F., Frozen L., and Dryttere A. J Mater Sci 22 (1987) 1
32. Allen K.W. Phys Tech 19 (1988) 234
33. Sobzak N., Stobierski L., Radziwill W., Ksiazek M., and Warmuzek M. Surf Interface Anal 36 (2004) 1067
34. Asthana R., and Sobczak N. JOM-e (2000) 52
35. Landry K., Kalogeropoulou S., and Eustathopoulos N. Mater Sci Eng A 254 (1998) 99
36. Gou J., Minaie B., Wang B., Liang Z., and Zhang C. Comput Mater Sci 31 (2004) 225
37. Thstenson E.T., Ren Z., and Chou T.W. Compos Sci Technol 61 (2001) 1899
38. Meyer R.R., Sloan J., Dunin-Borkowski R.E., Kirkland A.I., Novotny M.C., Bailey S.R., et al. Science 289 (2000) 1324
39. Banerjee S., Hemraj-Benny T., and Wong S.S. Adv Mater 17 (2005) 17
40. Bae J., Jang J., and Yoon S.H. Macromol Chem Phys 203 (2002) 2196
41. Eustathopoulos N. Acta Mater 46 (1998) 2319
42. Landry K., Rado C., Voitovich R., and Eustathopoulos N. Acta Mater 45 (1997) 3079
43. Landry K., and Eustathopoulos N. Acta Mater 44 (1996) 3923
44. Kalogeropoulou S., Rado C., and Eustathopoulos N. Scripta Mater 41 (1999) 723
45. Choh T., Kammel R., and Oki T. Z Mettalkde 78 (1987) 286
46. Landry K., Kalogeropoulou S., Eustathopoulos N., Naidich Y., and Krasovsky V. Scripta Mater 34 (1996) 841
47. Laha T., Agarwal A., McKechnie T., Rea K., and Seal S. Acta Mater 53 (2005) 5429
48. Rea K., Agarwal A., McKechnie T., and Seal S. Microsc Res Technol 66 (2005) 10
49. Fauchais P., Vardelle A., and Dussoubs B. J Thermal Spray Tech 1 (2001) 44
50. Herman H., and Sampath S. In: Stern K.H. (Ed). Metallurgical and protective coatings (1996), Chapman & Hall, London 261
51. Barr T.L., Seal S., Krezoski S., and Petering D.H. Surf Interface Anal 24 (1996) 99
52. In: Kosolapova T.Y. (Ed). Handbook of high temperature compounds: properties, production, applications (1990), Hemisphere, New York 228
53. Davies J.T., and Rideal E.K. Interfacial phenomena (1961), Academic Press, New York p. 34
54. Ip S.W., Sridhar R., Toguri J.M., Stephenson T.F., and Warner A.E.M. Mater Sci Eng A 244 (1998) 31
55. Candan E. Turkish J Eng Environ Sci 26 (2002) 1
56. Vattulainen J., Hamalainen E., Hernberg R., Vuoristo P., and Mantyla T. J Thermal Spray Tech 10 (2001) 94
57. Hon M.H., and Davis R.F. J Mater Sci 15 (1980) 2073
58. Favre A., Fuzellier H., and Suptil J. Ceram Int 29 (2003) 235
59. De Hosson J.Th.M. In: Dahotre N.B., and Sudarshan T.S. (Eds). Intermetallic and Ceramic Coatings (1999), Marcel Dekker, New York 307
60. Zhang Y., Ichihashi T., Landree E., Nihey F., and Iijima S. Science 285 (1999) 1719
61. Lee J.O., Park C., Kim J.J., Kim J., Park J.W., and Yoo K.H. J Phys D 33 (2000) 1953
62. Liu J.W., Zhong D.Y., Xie F.Q., Sun M., Wang E.G., and Liu W.X. Chem Phys Let 348 (2001) 357
63. Taylor A., and Laidler D.S. Brit J Appl Phys 1 (1950) 174