Electrical properties of multiwalled carbon nanotube reinforced fused silica composites

Journal of Nanoscience and Nanotechnology

Volumn 6, Issue 12, 2006, Pages 3835-3841

  Xiang, Changshu ^a   Pan, Yubai ^a   Liu, Xuejian ^a   Shi, Xiaomei ^a   Sun, Xingwei ^a   Guo, Jingkun ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

Author keywords

Composites; Electrical properties; Hot pressing, microstructure; Multiwalled carbon nanotube; Sol gel

Indexed keywords

HOT-PRESSING, MICROSTRUCTURE; MULTIWALLED CARBON NANOTUBE;

COMPOSITE MATERIALS; ELECTRIC PROPERTIES; FUSED SILICA; HOT PRESSING; SILICA; X RAY DIFFRACTION;

CARBON NANOTUBES;

CARBON NANOTUBE; SILICON DIOXIDE;

ARTICLE; CHEMISTRY; CONFORMATION; CRYSTALLIZATION; ELECTROCHEMISTRY; EVALUATION; IMPEDANCE; MACROMOLECULE; MATERIALS TESTING; METHODOLOGY; NANOTECHNOLOGY; PARTICLE SIZE; SURFACE PROPERTY; ULTRASTRUCTURE;

CRYSTALLIZATION; ELECTRIC IMPEDANCE; ELECTROCHEMISTRY; MACROMOLECULAR SUBSTANCES; MATERIALS TESTING; MOLECULAR CONFORMATION; NANOTECHNOLOGY; NANOTUBES, CARBON; PARTICLE SIZE; SILICON DIOXIDE; SURFACE PROPERTIES;

EID: 33845809225     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2006.603     Document Type: Conference Paper

References (39)

1. P. J. F. Harris, Int. Mater. Rev. 49, 31 (2004).
2. S. J. Tans, A. R. M. Verschueren, and C. Dekker, Nature (London) 393, 49 (1998).
3. Y. X. Liang, Y. J. Chen, and T. H. Wang, Appl. Phys. Lett. 85, 666 (2004).
4. Y. Saito, S. Uemura, and K. Hamaguchi, Jpn. J. Appl. Phys. 37, L346 (1998).
5. T. Kuzumaki, K. Miyazawa, H. Ichinose, and K. Ito, J. Mater. Res. 13, 2445 (1998).
6. W. X. Chen, J. P. Tu, L. Y. Wang, H. Y. Gan, Z. D. Xu, and X. B. Zhang, Carbon 41, 215 (2003).
7. Ch. Laurent, A. Peigney, O. Dumortier, and A. Rousset, J. Eur. Ceram. Soc. 18, 2005 (1998).
8. C. B. Mo, S. I. Cha, K. T. Kim, K. H. Lee, and S. H. Hong, Mater. Sci. Eng. A 395, 124 (2005).
9. L. S. Schadler, S. C. Giannaris, and P. M. Ajayan, Appl. Phys. Lett. 73, 3842 (1998).
10. D. Qian, E. C. Dickey, R. Andrews, and T. Rantell, Appl. Phys. Lett. 76, 2868 (2000).
11. M.-F. Yu, B. S. Files, S. Arepalli, and R. S. Ruoff, Phys. Rev. Lett. 84, 5552 (2000).
12. M.-F. Yu, O. Lourie, M. J. Dyer, K. Moloni, T. F. Kelly, and R. S. Ruoff, Science 287, 637 (2000).
13. Z. Ounaies, C. Park, K. E. Wise, E. J. Siochi, and J. S. Harrison, Compos. Sci. Technol. 63, 1637 (2003).
14. J. K. W. Sandler, J. E. Kirk, I. A. Kinloch, M. S. P. Shaffer, and A. H. Windle, Polymer 44, 5893 (2003).
15. C. A. Martin, J. K. W. Sandler, M. S. P. Shaffer, M.-K. Schwarz, W. Bauhofer, K. Schulte, and A. H. Windle, Compos. Sci. Technol. 64, 2309 (2004).
16. X. J. He, J. H. Du, Z. Ying, and H. M. Cheng, Appl. Phys. Lett. 86, 062112 (2005).
17. L. Wang and Z.-M. Dang, Appl. Phys. Lett. 87, 042903 (2005).
18. J. W. Mintmire, B. I. Dunlap, and C. T. White, Phys. Rev. Lett. 68, 631 (1992).
19. N. Hamada, S.-I. Sawada, and A. Oshiyama, Phys. Rev. Lett. 68, 1579 (1992).
20. R. Z. Ma, J. Wu, B. O. Wei, J. Liang, and D. H. Wu, J. Mater. Sci. 33, 5243 (1998).
21. G.-D. Zhan, J. D. Kuntz, J. L. Wan, and A. K. Mukherjee, Nat. Mater. 2, 38 (2003).
22. L. N. An, W. X. Xu, S. Rajagopalan, C. M. Wang, H. Wang, Y. Fan, L. G. Zhang, D. P. Jiang, J. Kapat, L. Chow, B. H. Guo, J. Liang, and R. Vaidyanathan, Adv. Mater. 16, 2036 (2004).
23. Cs. Balázsi, Z. Shen, Z. Kónya, Zs. Kasztovszky, F. Wéber, Z. Vértesy, L. P. Biró, I. Kiricsi, and P. Arató, Compos. Sci. Technol. 65, 727 (2005).
24. F. Lupo, R. Kamalakaran, C. Scheu, N. Grobert, and M. Rühle, Carbon 42, 1995 (2004).
25. J. Wang, H. M. Kou, X. J. Liu, Y. B. Pan, and J. K. Guo, Ceram. Int. (in print).
26. J. W. Ning, J. J. Zhang, Y. B. Pan, and J. K. Guo, Mater. Sci. Eng. A 357, 392 (2003).
27. E. Flahaut, A. Peigney, Ch. Laurent, Ch. Marlière, F. Chastel, and A. Rousset, Acta Mater. 48, 3803 (2000).
28. A. Peigney, E. Flahaut, Ch. Laurent, F. Chastel, and A. Rousset, Chem. Phys. Lett. 352, 20 (2002).
29. G.-D. Zhan, J. D. Kuntz, J. E. Garay, and A. K. Mukherjee, Appl. Phys. Lett. 83, 1228 (2003).
30. S. Rul, F. Lefèvre-schlick, E. Capria, Ch. Laurent, and A. Peigney, Acta Mater. 52, 1061 (2004).
31. D. C. Jia, Y. Zhou, and T. C. Lei, J. Eur. Ceram. Soc. 23, 801 (2003).
32. C.-M. Xu, S. W. Wang, X. X. Huang, and J. K. Guo, J. Mater. Res. 20, 1943 (2005).
33. J. W. Ning, J. J Zhang, Y. B. Pan, and J. K. Guo, Ceram. Int. 30, 63 (2004).
34. C. S. Xiang, Y. B. Pan, X. J. Liu, X. W. Sun, X. M. Shi, and J. K. Guo, Appl. Phys. Lett. 87, 123103 (2005).
35. Z.-M. Li, X.-B. Xu, A. Lu, K.-Z. Shen, R. Huang, and M.-B Yang, Carbon 42, 423 (2004).
36. R. Q. Ou, R. A. Gerhardt, C. Marrett, A. Moulart, and J. S. Colton, Compos. Part B-Eng. 34, 607 (2003).
37. T. Seeger, Th. Köhler, Th. Frauenheim, N. Grobert, M. Rühle, M. Terrones, and G. Seifert, Chem. Commun. 34 (2002).
38. F. El-Tantawy, K. Kamada, and H. Ohnabe, Mater. Lett. 56, 112 (2002).
39. J. D. Walton, Jr., Am. Ceram. Soc. Bull. 53, 255 (1974).