Analysis of Si/GaAs bonding stresses with the finite element method

Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

Volumn 27, Issue 11, 2006, Pages 1906-1910

  He, Guorong ^a   Yang, Guohua ^a   Zheng, Wanhua ^a   Wu, Xuming ^a   Wang, Xiaodong ^a   Cao, Yulian ^a   Wang, Qing ^a   Chen, Lianghui ^a  

^a INSTITUTE OF SEMICONDUCTORS   (China)

Author keywords

Bonding; Finite element analysis; Thermal stress

Indexed keywords

BONDING; CALCULATIONS; FINITE ELEMENT METHOD; PEELING; SEMICONDUCTING GALLIUM ARSENIDE; SHEAR STRESS; THERMAL EXPANSION; THERMAL STRESS;

FINITE ELEMENT ANALYSIS; NUMERICAL MODEL; PEELING STRESS;

SEMICONDUCTOR MATERIALS;

EID: 33845789187     PISSN: 02534177     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

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