Fabrication of a polymeric tapered HARMs array utilizing a low-cost nickel electroplated mold insert

Microsystem Technologies

Volumn 13, Issue 3-4, 2007, Pages 287-291

  Song, In Hyouk ^a   Jin, Yoonyoung ^a   Ajmera, Pratul K ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTROPLATING; PHOTORESISTS; POLYMETHYL METHACRYLATES; SURFACE ROUGHNESS;

GLASS WAFER; HOT EMBOSSING; MOLD INSERT; POLYDIMETHYLSILOXANE;

MICROSTRUCTURE;

EID: 33845774866     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0212-1     Document Type: Article

References (5)

1. Becher EW, Ehrfeld W, Hagmann P, Maner A, Muenchmeyer D (1986) Fabrication of microstructures with high aspect ratio and great structural heights by synchrotron radiation lithography, electroforming and plastic molding (LIGA process). Microelectron Eng 4:35-56
2. Despont M, Lorenz H, Fahrni N, Brugger J, Renaud P, Vettiger P (1997) High-aspect-ratio, ultrathick, negative-tone near-uv photoresist for MEMS applications. In: Micro Electro Mechanical Systems, 1997, MEMS '97, Proceedings IEEE, 10th annual international workshop, 26-30 January 1997, pp. 518-522
3. Kim K, Park DS, Lu HM, Che W, Kim K, Lee JB, Ahn CH (2004) A tapered hollow metallic microneedle array using backside exposure of SU-8. J Micromech Microeng 14:597-603
4. Peterman MC, Huie P, Bloom DM, Fishman HA (2003) Building thick photoresist structures from the bottom up. J Micromech Microeng 13:380-382
5. Turner R, Desta Y, Kelly K, Zhang J, Geiger E, Cortez S, Mancini DC (2003) Tapered LIGA HARMs. J Micromech Microeng 13:367-372