Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 952-958

  Kim, Hyoung Joon ^a   Chung, Chang Kyu ^a   Yim, Myung Jin ^a   Hong, Soon Min ^b   Jang, Se Young ^b   Moon, Young Joon ^b   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS (ACF); BONDING TEMPERATURE; FLEXIBLE SUBSTRATE (FS); MOISTURE PENETRATION PATH;

ANISOTROPY; BONDING; BUBBLE FORMATION; ELECTRIC CONNECTORS; INTERFACIAL ENERGY; SUBSTRATES;

CONDUCTIVE FILMS;

EID: 33845591818     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645769     Document Type: Conference Paper

References (7)

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