Bending simulation of BGA SMT assemblies and application to system level drop simulation

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1331-1339

  Carroll, Doug ^a   Zampino, Marc ^a   Jones, Kinzy ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COMPUTER SIMULATION; ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS; RELIABILITY; STRAIN MEASUREMENT;

BENDING STRAINS; DYNAMIC BENDING; JOINT PACKAGE INTERFACES;

SOLDERED JOINTS;

EID: 32844456059     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73475     Document Type: Conference Paper

References (8)

1. Tee, T-Y, Ng, N-H, Lim, C-T, Pek, E. and Zhong, Z., "Board level drop test and simulation of TFBGA packages for telecommunication applications," Proc. 53rd Electronic Components and Technology Conf., 2003, p 121-129
2. rd Electronic Components and Technology Conf., 2003, p 317-322
3. Amagai, M., Toyoda, Y., Ohnishi, T., Akita, S., "High drop test reliability: lead-free solders," Proc. 54th Electronic Components and Technology Conf, 2004, p 1304-1309
4. Reiff, D., Bradley, E., "A novel mechanical shock test method to evaluate lead-free BGA solder joint reliability", Proc. 55th Electronic Components and Technology Conf., 2005, in press
5. Bradley, E., Internal Motorola document, April 2004
6. "Database for Solder Properties With Emphasis on Lead-free Solders", Release 4.0, National Institute of Standards and Technology Colorado School of Mines
7. "ABAQUS Users Manual", Version 6.4, ABAQUS Inc., 2004
8. Reiff, D., Internal Motorola document, September 2003