Fluxless flip chip technique with Sn-rich Au/Sn solder bumps

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 840-843

  Kim, Dongwook ^a   Lee, Chin C ^a   Sokolwski, Witold M ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; ELECTRON DEVICES; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; HIGH TEMPERATURE OPERATIONS; MELTING; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; QUALITY CONTROL; SCANNING ELECTRON MICROSCOPY; SOLDERING; TIN ALLOYS;

FLUXLESS FLIP CHIP TECHNIQUE; RE MELTING TEMPERATURE; SCANNING ACOUSTIC MICROSCOPE; SELF ALIGNING EFFECT; SOLDER BUMPS; VOID FREE SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 0038688994     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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