Effect of hard particle perturbation on microstructure and property of electroformed copper

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 16, Issue 9, 2006, Pages 1558-1562

  Zhu, Zeng Wei ^a   Zhu, Di ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Copper; Electrodeposition; Electroformation; Hard particle; Property; Structure

Indexed keywords

COPPER; CORROSION RESISTANCE; ELECTRODEPOSITION; MICROHARDNESS; MICROSTRUCTURE; MORPHOLOGY; POLISHING; X RAY DIFFRACTION ANALYSIS;

CORROSION RATE; ELECTROFORMATION; HARD PARTICLE; PROPERTY;

ELECTROFORMING;

EID: 33751580297     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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