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Volumn 44, Issue 9, 2001, Pages 831-836

A new copper electroforming for vacuum components and comparison with conventional processes

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; CHARACTERIZATION; COPPER; ELECTROFORMING; ELECTROLYTES; THERMODYNAMIC STABILITY;

EID: 0035195492     PISSN: 05598516     EISSN: None     Source Type: Journal    
DOI: 10.3131/jvsj.44.831     Document Type: Article
Times cited : (2)

References (13)
  • 7
    • 0006777071 scopus 로고
    • Japanese
    • (1971) , vol.18 , pp. 107


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.