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Volumn 44, Issue 9, 2001, Pages 831-836
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A new copper electroforming for vacuum components and comparison with conventional processes
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Author keywords
[No Author keywords available]
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Indexed keywords
ADDITIVES;
CHARACTERIZATION;
COPPER;
ELECTROFORMING;
ELECTROLYTES;
THERMODYNAMIC STABILITY;
COPPER ELECTROFORMING;
PYROPHOSPHATE;
VACUUM COMPONENT;
VACUUM;
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EID: 0035195492
PISSN: 05598516
EISSN: None
Source Type: Journal
DOI: 10.3131/jvsj.44.831 Document Type: Article |
Times cited : (2)
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References (13)
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