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Proceedings of ESSDERC 2005: 35th European Solid-State Device Research Conference

Volumn 2005, Issue , 2005, Pages 109-112

Work function control of metal gates by interdiffused Ni-Ta with high thermal stability

(10) Matsukawa, T a Liu, Y X a Masahara, M a Endo, K a Ishii, K a Yamauchi, H a Sugimata, E a Takashima, H a Kanemaru, S a Suzuki, E a

a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BINDING ENERGY; CAPACITANCE MEASUREMENT; DIFFUSION; GATES (TRANSISTOR); MICROSCOPIC EXAMINATION; NICKEL ALLOYS; TANTALUM; THERMODYNAMIC STABILITY; VOLTAGE MEASUREMENT;

METAL GATES; SCANNING MAXWELL-STRESS MICROSCOPY; WORK FUNCTION;

MOSFET DEVICES;

EID: 33751394186 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ESSDER.2005.1546597 Document Type: Conference Paper

Times cited : (2)

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