Curing of an epoxy resin modified with nanoclay monitored by dielectric spectroscopy and rheological measurements

Journal of Applied Polymer Science

Volumn 102, Issue 6, 2006, Pages 5927-5933

  Kortaberria, G ^a   Solar, L ^b   Jimeno, A ^a   Arruti, P ^a   Gomez C ^b   Mondragon, I ^a  

^a UNIVERSITY OF THE BASQUE COUNTRY UPV EHU   (Spain)

^b UNIVERSITY OF VALENCIA   (Spain)

Author keywords

Dielectric properties; Organoclay; Relaxation; Rheology; Thermosets

Indexed keywords

CHEMICAL MODIFICATION; DIELECTRIC PROPERTIES; NANOSTRUCTURED MATERIALS; RELAXATION PROCESSES; RHEOLOGY; THERMOSETS;

CATALYTIC EFFECT; DIELECTRIC SPECTROSCOPY; ORGANOCLAY;

EPOXY RESINS;

CATALYST; CONDUCTIVITY; CURING; DIELECTRIC PROPERTY; EPOXY RESIN; NANOCOMPOSITE; RHEOLOGY;

EID: 33751328055     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.25108     Document Type: Article

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