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Composites Science and Technology

Volumn 64, Issue 16, 2004, Pages 2501-2507

Monitoring the curing process of epoxy resin nanocomposites based on organo-montmorillonite - A new application of resin curemeter

(2) Chen, Dazhu a He, Pingsheng a

a UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA (China)

Author keywords

A. Nanocomposite; B. Epoxy resin; C. Curing; D. Resin Curemeter; E. Activation energy

Indexed keywords

ACTIVATION ENERGY; CROSSLINKING; CURING; EPOXY RESINS; REACTION KINETICS; SILICATES; THERMODYNAMICS;

CROSS-LINKING REACTION; CURE TEMPERATURE; RELAXATION TIME; RESIN SYSTEM;

NANOSTRUCTURED MATERIALS;

NANOCOMPOSITE;

EID: 6444236151 PISSN: 02663538 EISSN: None Source Type: Journal
DOI: 10.1016/j.compscitech.2004.05.008 Document Type: Article

Times cited : (30)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.