Self-formed barrier with Cu-Mn alloy metallization and its effects on reliability

AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 43-51

  Koike, J ^a   Wada, M ^a   Usui, T ^b   Nasu, H ^b   Takahashi, S ^b   Shimizu, N ^b   Yoshimaru, M ^b   Shibata, H ^b  

^a TOHOKU UNIVERSITY   (Japan)

^b SEMICONDUCTOR TECHNOLOGY ACADEMIC RESEARCH CENTER   (Japan)

Author keywords

Alloy; Barrier; Copper; Interconnect

Indexed keywords

EID: 33751252824     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173530     Document Type: Conference Paper

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