Size effect and microscopic experimental analysis of copper foils in fracture

Key Engineering Materials

Volumn 324-325 I, Issue , 2006, Pages 263-266

  Wang, Huaiwen ^a   Ji, Hongwei ^a  

^a TIANJIN UNIVERSITY OF COMMERCE   (China)

Author keywords

Copper foil; Fracture toughness; Microscopic investigation; Size effect; Thickness effect

Indexed keywords

COPPER; CRACK INITIATION; FRACTURE TOUGHNESS; MICROSCOPIC EXAMINATION; THICKNESS MEASUREMENT;

COPPER FOILS; MICROSCOPIC INVESTIGATIONS; SIZE EFFECTS; THICKNESS EFFECTS;

METAL FOIL;

EID: 33750902253     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-413-8.263     Document Type: Conference Paper

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