Technologies for highly miniaturized autonomous sensor networks

Microelectronics Journal

Volumn 37, Issue 12, 2006, Pages 1563-1568

  Baert, K ^a,b   Gyselinckx, B ^a   Torfs, T ^a   Leonov, V ^a   Yazicioglu, F ^a   Brebels, S ^a   Donnay, S ^a   Vanfleteren, J ^a,c   Beyne, E ^a   Van Hoof, C ^a  

^a IMEC   (Belgium)

^b HOLST CENTRE   (Netherlands)

^c Technology Park   (Belgium)

Author keywords

Advanced integration and packaging; Autonomous sensors; Smart sensors; Ultra low power electronics

Indexed keywords

ELECTROENCEPHALOGRAPHY; ELECTRONICS PACKAGING; POWER ELECTRONICS;

ADVANCED INTEGRATION AND PACKAGING; AUTONOMOUS SENSORS; SMART SENSORS; ULTRA-LOW-POWER ELECTRONICS;

SENSORS;

EID: 33750744802     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2006.04.018     Document Type: Article

References (17)

1. Schmidt R., et al. Body area network BAN, a key infrastructure element for patient-centered medical applications. Biomed. Tech. (Berl) 47 suppl. 1 part 1 (2002) 365-368
2. H. De Man, ISSCC 2005 keynote address, 2005.
3. S. Stoukatch, M. Ho, K. Vaesen, T. Webers, G. Carchon, W. De Raedt, E. Beyne, J. De Baets, Miniaturization using 3-D stack structure for SiP application, Proceedings of the SMTA (Surface Mount Technology Association) International Conference, Chicago, 21-29 September 2003.
4. Tubasihat M., and Madria S. Sensor networks: an overview. IEEE Potentials 22 2 (2003) 20-23
5. T. Torfs, S. Sanders, C. Winters, S. Brebels, C. Van Hoof, Wireless network of autonomous environmental sensors, Proceedings of IEEE Sensors 2004, Vienna, 24-27 October 2004.
6. Yazicioglu R.F., Merken P., and Van Hoof C. Integrated low-power 24-channel EEG front-end. Electron. Lett. 41 8 (2005) 457-458
7. V. Leonov, P. Fiorini, S. Sedky, T. Torfs, C. Van Hoof, Thermoelectric MEMS generators as a power supply for a body area network, Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers'05), Seoul, Korea, 5-9 June 2005, pp. 291-294.
8. A.A. Ahmed, A Survey on Network Protocols for Wireless Sensor Networks, Information Technology: Research and Education, 2003 Proceedings, pp. 301-305.
9. M.A.M. Vieira, et al., Survey on wireless sensor network devices, IEEE Emerging Technologies and Factory Automation 2003 Proceedings, vol. 1, pp. 537-544.
10. 3 solarpowered node for distributed wireless sensor networks, IEEE Sensors 2002 Proceedings, vol. 2, pp. 1510-1515.
11. E. Beyne, 3D interconnection and packaging: impending reality or still a dream? Proceedings of the IEEE International Solid-State Circuits Conference, ISSCC2004, 15-19 February 2004, IEEE, San Francisco, CA, USA, 2004, pp.138-145.
12. P. Garrou, 3D Integration: A Status Report, Proceedings "3D Architectures for Semiconductor Integration and Packaging", RTI International, Burlingame, Tempe, Arizona, 13-15 June 2005.
13. S. List, The Third Dimension: Fact or Fiction?, RTI International, Burlingame, Tempe, Arizona, 13-15 June 2005.
14. A. Young, Perspectives on 3D-IC Technology, RTI International, Burlingame, Tempe, Arizona, 13-15, June 2005.
15. A. Klump et al., 3D Integration of CMOS Transistors with ICV-SLID Technology, RTI International, Burlingame, Tempe, Arizona, 13-15, June 2005.
16. M. Karnezos, 3-D Packaging: Where All Technologies Come Together. IEEE/SEMI 29th International Electronics Manufacturing Technology Symposium, July 2004, pp. 64-67.
17. N. Ranganathan, et.al., High aspect ratio through-wafer interconnect for three dimensional integrated circuits, Proceedings of the 55th ECTC, Orlando, FL, May 31-June 3, 2005, pp. 343-348.