A study of multiple singularities in multi-material wedges and their use in analysis of microelectronic interconnect structures

Engineering Fracture Mechanics

Volumn 74, Issue 3, 2007, Pages 416-430

  Luo, Yaping ^a   Subbarayan, Ganesh ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Interconnects; Microelectronics; Multi material wedge; Multiple singularities

Indexed keywords

ELASTICITY; INTERFACES (MATERIALS); STRESS INTENSITY FACTORS; STRESSES;

MICROELECTRONIC INTERCONNECT STRUCTURES; MULTI-MATERIAL WEDGE; MULTIPLE SINGULARITIES;

MICROELECTRONICS;

ELASTICITY; INTERFACES (MATERIALS); MICROELECTRONICS; STRESS INTENSITY FACTORS; STRESSES;

EID: 33750628941     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfracmech.2006.04.032     Document Type: Article

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