Effect of stiffness and thickness ratios on popcorn cracking in IC packages

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 2, 2003, Pages 340-348

  Chue, Ching Hwei ^a   Chen, Teng Hui ^b   Lee, Hwa Teng ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b YUNG TA INSTITUTE OF TECHNOLOGY AND COMMERCE   (Taiwan)

Author keywords

IC package; Popcorn cracking; Strain energy density theory; Stress singularity; Structural instability; Wedge problem

Indexed keywords

DELAMINATION; STIFFNESS; STRESS INTENSITY FACTORS; THERMAL LOAD;

STRAIN ENERGY DENSITY THEORY; STRESS SINGULARITY; STRUCTURAL INSTABILITY; WEDGE PROBLEM;

ELECTRONICS PACKAGING;

EID: 0042466541     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.815097     Document Type: Article

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