Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder

Rare Metals

Volumn 25, Issue 4, 2006, Pages 365-370

  Shen, Jun ^a   Liu, Yongchang ^b   Han, Yajing ^b   Gao, Houxiu ^b  

^a CHONGQING UNIVERSITY   (China)

^b TIANJIN UNIVERSITY   (China)

Author keywords

Dispersion strengthening effect; Intermetallic compounds; Lead free solder; Nanoparticulate; Rapid solidification

Indexed keywords

DISLOCATIONS (CRYSTALS); DISPERSIONS; INTERMETALLICS; MICROHARDNESS; MICROSTRUCTURE; MORPHOLOGY; NUCLEATION; RAPID SOLIDIFICATION; SILVER ALLOYS; STRENGTHENING (METAL); TIN ALLOYS;

DISPERSION-STRENGTHENING EFFECT; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; NANOPARTICULATE;

SOLDERING ALLOYS;

EID: 33750396210     PISSN: 10010521     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1001-0521(06)60069-7     Document Type: Article

References (12)

1. Laurila T., Vuorinen V., and Kivilahti J. K., Interfacial reactions between lead-free solders and common base materials, Mater. Sci. Eng. R, 2005, 49: 1.
2. Kim K. S., Huh S. H., and Suganuma K., Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys, Mater. Sci. Eng. A, 2002, 333: 106.
3. Dutta I., Park C., and Choi S., Impression creep characterization of rapidly cooled Sn-3.5Ag solders, Mater. Sci. Eng. A, 2004, 379: 401.
4. Kim K. S., Huh S. H., and Suganuma K., Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints, J. Alloys Compd., 2003, 352: 226.
5. Ochoa F., Williams J. J., and Chawla N., Effect of cooling rate on the microstructure and mechanical behavior of Sn-3.5Ag solder, JOM, 2003, 55: 56.
6. Ochoa F., Williams J. J., and Chawla N., Effects of cooling rate on the microstructure and tensile behavior of an Sn-3.5 wt.% Ag solder, J. Electron. Mater., 2003, 32: 1414.
7. Chevalier P. Y., A thermodynamic evaluation of the Ag-Sn system, Thermochim. Acta, 1988, 136: 45.
8. Meyers M. A. and Chawla K. K., Mechanical Behavior of Materials, Prentice-Hall, Upper Saddle River, NJ, 1998: 135.
9. 3Sn intermetallic compounds in Sn-Ag lead-free solders in solidification, J. Electron. Mater., 2005, 34: 1591.
10. Chalmers B., Principles of Solidification, John Wiley and Sons Inc., New York, 1964: 6.
11. Deng X., Chawla N., Chawla K. K., and Koopman M., Deformation behavior of (Cu, Ag)-Sn intermetallics by nanoindentation, Acta Mater., 2004, 52: 4291.
12. Kuanfu H., Mico-Theory of Metallic Mechanical Property (in Chinese), Science Press, Beijing, 1983: 122.